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d a t a sh eet product speci?cation file under integrated circuits, ic01 may 1992 integrated circuits tda1519a 22 w btl or 2 x 11 w stereo car radio power amplifier
may 1992 2 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a general description the tda1519a is an integrated class-b dual output amplifier in a 9-lead single in-line (sil) plastic power package. the device is primarily developed for car radio applications. features requires very few external components for bridge tied load (btl) stereo or btl application high output power low offset voltage at output (important for btl) fixed gain good ripple rejection mute/stand-by switch load dump protection ac and dc short-circuit-safe to ground and v p thermally protected reverse polarity safe capability to handle high energy on outputs (v p = 0 v) no switch-on/switch-off plop protected against electrostatic discharge low thermal resistance identical inputs (inverting and non-inverting) compatible with tda1519b (except output power). quick reference data parameter conditions symbol min. typ. max. unit supply voltage range operating v p 6.0 14.4 17.5 v non-operating v p -- 30 v load dump protected v p -- 45 v repetitive peak output current i orm -- 4a total quiescent current i tot - 40 80 ma stand-by current i sb - 0.1 100 m a switch-on current i sw -- 40 m a input impedance btl |z i |25 -- k w stereo |z i |50 -- k w stereo application output power thd = 10%; 4 w p o - 6 - w thd = 10%; 2 w p o - 11 - w channel separation a 40 -- db noise output voltage v no(rms) - 150 -m v
may 1992 3 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a package outlines 9 lead sil; plastic power (sot131); sot131-2; 1996 july 22. 9-lead sil-bent-to-dil; plastic power (sot157); sot157-2; 1996 july 22. btl application output power thd = 10%; 4 w p o - 22 - w supply voltage ripple rejection r s = 0 w f = 100 hz rr 34 -- db f = 1 khz to 10 khz rr 48 -- db dc output offset voltage | d v 0 | -- 250 mv crystal temperature t c -- 150 c parameter conditions symbol min. typ. max. unit
may 1992 4 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a fig.1 block diagram.
may 1992 5 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a pinning functional description the tda1519a contains two identical amplifiers with differential input stages. the gain of each amplifier is fixed at 40 db. a special feature of this device is the mute/stand-by switch which has the following features: low stand-by current ( < 100 m a) low mute/stand-by switching current (low cost supply switch) mute condition. ratings limiting values in accordance with the absolute maximum system (iec 134) 1 ninv non-inverting input 2 gnd1 ground (signal) 3 rr supply voltage ripple rejection 4 out1 output 1 5 gnd2 ground (substrate) 6 out2 output 2 7v p positive supply voltage 8 m/ss mute/stand-by switch 9 inv inverting input parameter conditions symbol min. max. unit supply voltage operating v p - 17.5 v non-operating v p - 30 v load dump protected during 50 ms; t r 3 2.5 ms v p - 45 v ac and dc short-circuit-safe voltage v psc - 18 v reverse polarity v pr - 6v energy handling capability at outputs v p = 0 v - 200 mj non-repetitive peak output current i osm - 6a repetitive peak output current i orm - 4a total power dissipation see fig.2 p tot - 25 w crystal temperature t c - 150 c storage temperature range t stg - 55 + 150 c
may 1992 6 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a dc characteristics v p = 14.4 v; t amb = 25 c; measurements taken using fig.3; unless otherwise speci?ed parameter conditions symbol min. typ. max. unit supply supply voltage range note 1 v p 6.0 14.4 17.5 v total quiescent current i tot - 40 80 ma dc output voltage note 2 v o - 6.95 - v dc output offset voltage | d v 4-6 | -- 250 mv mute/stand-by switch switch-on voltage level v on 8.5 -- v mute condition v mute 3.3 - 6.4 v output signal in mute position v i = 1 v (max.); f = 20 hz to 15 khz v o -- 20 mv dc output offset voltage | d v 4-6 | -- 250 mv fig.2 power derating curve.
may 1992 7 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a ac characteristics v p = 14.4 v; r l = 4 w ; f = 1 khz; t amb = 25 c; measurements taken using fig.3; unless otherwise speci?ed stand-by condition v sb 0 - 2v dc current in stand-by condition i sb -- 100 m a switch-on current i sw - 12 40 m a parameter conditions symbol min. typ. max. unit stereo application output power note 3 thd = 0.5% p o 45 - w thd = 10% p o 5.5 6.0 - w output power at r l = 2 w note 3 thd = 0.5% p o 7.5 8.5 - w thd = 10% p o 10 11 - w total harmonic distortion p o = 1 w thd - 0.1 - % low frequency roll-off note 4 - 3 db f l - 45 - hz high frequency roll-off - 1 db f h 20 -- khz closed loop voltage gain g v 39 40 41 db supply voltage ripple rejection on notes 5 and 6 rr 40 -- db on notes 5 and 7 rr 45 -- db mute notes 5 and 8 rr 45 -- db stand-by notes 5 and 8 rr 80 -- db input impedance |z i |506075k w noise output voltage (rms value) note 9 on r s = 0 w v no(rms) - 150 -m v on r s = 10 k w v no(rms) - 250 500 m v mute note 10 v no(rms) - 120 -m v channel separation r s = 10 k wa 40 -- db channel unbalance | d g v | - 0.1 1 db parameter conditions symbol min. typ. max. unit
may 1992 8 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a ac characteristics v p = 14.4 v; r l = 4 w ; f = 1 khz; t amb = 25 c; measurements taken using fig.4; unless otherwise speci?ed notes to the characteristics 1. the circuit is dc adjusted at v p = 6 v to 17.5 v and ac operating at v p = 8.5 v to 17.5 v. 2. at 17.5 v < v p < 30 v the dc output voltage v p /2. 3. output power is measured directly at the output pins of the ic. 4. frequency response externally fixed. 5. ripple rejection measured at the output with a source impedance of 0 w (maximum ripple amplitude of 2 v). 6. frequency f = 100 hz. 7. frequency between 1 khz and 10 khz. 8. frequency between 100 hz and 10 khz. 9. noise voltage measured in a bandwidth of 20 hz to 20 khz. 10. noise output voltage independent of r s (v i = 0 v). parameter conditions symbol min. typ. max. unit btl application output power note 3 thd = 0.5% p o 15 17 - w thd = 10% p o 20 22 - w output power at v p = 13.2 v note 3 thd = 0.5% p o - 13 - w thd = 10% p o - 17.5 - w total harmonic distortion p o = 1 w thd - 0.1 - % power bandwidth thd = 0.5%; p o = - 1 db; 35 to w.r.t. 15 w b w - 15 000 - hz low frequency roll-off note 4 - 1 db f l - 45 - hz high frequency roll-off - 1 db f h 20 -- khz closed loop voltage gain g v 45 46 47 db supply voltage ripple rejection on notes 5 and 6 rr 34 -- db on notes 5 and 7 rr 48 -- db mute notes 5 and 8 rr 48 -- db stand-by notes 5 and 8 rr 80 - -db input impedance |z i | 253038k w noise output voltage (rms value) note 9 on r s = 0 w v no(rms) - 200 -m v on r s = 10 k w v no(rms) - 350 700 m v mute note 10 v no(rms) - 180 -m v
may 1992 9 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a application information fig.3 stereo application circuit diagram. fig.4 btl application circuit diagram.
may 1992 10 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a fig.5 total quiescent current (i tot ) as a function of supply voltage (v p ). fig.6 output power (p o ) as a function of supply voltage (v p ) for btl application at r l = 4 w ; f = 1 khz.
may 1992 11 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a fig.7 total harmonic distortion (thd) as a function of output power (p o ) for btl application at r l = 4 w ; f = 1 khz. fig.8 total harmonic distortion (thd) as a function of operating frequency (f) for btl application at r l = 4 w ; p o = 1 w.
may 1992 12 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a package outlines unit a b max. b p 2 cd (1) e (1) z (1) de d h l j references outline version european projection issue date iec jedec eiaj mm 4.6 4.2 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 3.4 3.1 a max. 1 2.0 e h 6 2.00 1.45 2.1 1.8 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 17.2 16.5 sot131-2 92-11-17 95-03-11 0 5 10 mm scale q 0.25 w 0.03 x d l a e c a 2 q w m b p d d z e x h 19 e h non-concave seating plane 1 b j sil9p: plastic single in-line power package; 9 leads sot131-2 view b : mounting base side b
may 1992 13 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a unit a a e 1 2 b p cd (1) e (1) z (1) de d h ll 3 m references outline version european projection issue date iec jedec eiaj mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 5.08 12.2 11.8 2.54 e 2 5.08 2.4 1.6 e h 6 2.00 1.45 0.8 3.4 3.1 4.3 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 12.4 11.0 sot157-2 0 5 10 mm scale v 2.1 1.8 q j 0.25 w 0.03 x d l e a c a 2 l 3 q w m b p 1 d d z e e x h 19 j e h non-concave 92-10-12 95-03-11 dbs9p: plastic dil-bent-sil power package; 9 leads (lead length 12 mm) sot157-2 b view b : mounting base side m 2 e v m
may 1992 14 philips semiconductors product speci?cation 22 w btl or 2 x 11 w stereo car radio power ampli?er tda1519a soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). soldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. repairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.

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